Cellecta Hexatherm XCHiP 158mm Thermal Floor Insulation

The 158mm Cellecta Hexatherm XCHiP insulation board is a premium-grade PIR thermal insulation solution engineered for high-performance floor and basement applications. Designed with a rigid closed-cell insulation core bonded to a durable chipboard facing, it delivers strong thermal efficiency alongside excellent structural strength and moisture resistance.

This makes it particularly suitable for basement insulation systems and below-ground applications, where exposure to moisture, load-bearing requirements, and long-term thermal stability are critical. The board is widely used in UK construction projects where reliable insulation performance and durability are essential for modern building standards.

Technical Specification Summary

1. Brand: Cellecta Hexatherm XCHiP
2. Thickness: 158mm (140mm PIR + 18mm plywood)
3. Width: 600mm
4. Length: 2400mm
5. Pack of: 1
6. Board Coverage: 1.44m2
7. Pack Coverage: 1.44m2
8. Boards per pallet: 12
9. Coverage per pallet: 17.28 m2
10. Water Absorption (long term): 0.7%
11. Chipboard Grade: P5
12. Edge Profile: Tongue & groove
13. Product Build-up: PIR insulation bonded with structural chipboard facing

Key Performance Features

• High compressive strength for demanding structural floor applications
• Rigid chipboard facing for added durability and load distribution
• Long-term thermal efficiency for reduced heat loss
• Suitable for heavy point loads in domestic and commercial environments
• Closed-cell PIR core for enhanced thermal performance
• Suitable for damp and moisture-prone environments
• Manufactured using environmentally responsible blowing agents
• Fully recyclable insulation solution for sustainable construction
• Designed to achieve very low U-values in compliant building systems

Application Areas

Cellecta 158mm Hexatherm XCHiP insulation boards are commonly specified for underfloor heating insulation systems, where consistent heat distribution and reduced thermal loss are essential for energy-efficient performance.

The boards act as a stable insulation layer beneath underfloor heating installations, helping to maintain heat output while improving overall system efficiency in both residential and commercial buildings.

In addition to heated floor systems, XCHiP is widely used in:

1. Solid concrete floor constructions
2. Suspended timber floor systems
3. Beam and block flooring applications
4. New-build and refurbishment projects requiring high load-bearing insulation

Their rigid structure and lightweight handling make them suitable for modern construction environments where speed of installation and performance reliability are important.

Where to Use

Ideal for both domestic and commercial UK construction projects, 158mm Cellecta Hexatherm XCHiP supports improved building energy performance by reducing heat loss and enhancing floor insulation efficiency. It is especially effective in applications requiring a combination of strength, moisture resistance, and long-term thermal stability.

Installation Guide

1. Ensure the concrete subfloor is clean, dry, level, and free from debris before installation. A damp proof membrane (DPM) should be installed where required.
2. Fit perimeter expansion edging around all walls and upstands before laying the boards.
3. Lay the Cellecta HEXATHERM XCHIP boards in a staggered brick-bond pattern with the tongue and groove edges tightly interlocked.
4. Start installation from one corner of the room and work across the floor, ensuring all joints are fully supported and tightly butted together.
5. Cut boards to size using a fine-tooth saw where required, ensuring neat fitting around edges and service penetrations.
6. Avoid gaps between boards to maintain thermal performance and structural stability.
7. Once installed, the floor system can be finished with the appropriate floor covering in accordance with the manufacturer’s recommendations.
8. Store boards indoors on a flat, dry surface before installation and protect from prolonged exposure to moisture.